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PICLS

PICLS

Tool for real-time thermal simulation of printed circuit boards PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation,you will obtain a simulation result without stress through the tool’s easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

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PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool’s easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

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Description

PICLS

Tool for real-time thermal simulation of printed circuit boards.

PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool’s easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

  • Troubleshooting thermal issues of current products
  • Examining thermal interferences of part layouts
  • Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the performance of a heat sink
  • Examine the size of a PCB
  • Examine the number of layers and the thickness of copper foil
  • Consider natural/forced air cooling
  • Consider radiant heat
  • Considering heatsinks (number of fins, size
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment

Advantages

  •  Easy to use
    (Operation in 2D, integrated GUI for pre- and post-processing)
  • Inexpensive
  • Capable of real-time analysis

Thermal countermeasures using PICLS

  • Checking the layout of components to avoid interference of heat
    between them
  • Troubleshooting thermal issues of current products
  • Considering heat release depending on a wiring pattern
    (coverage ratio)
  • Examining the location and the number of thermal vias
  • Examining the performance of a heatsink
  • Examining the size of a PCB
  • Examining the number of layers and the thickness of copper foil
  • Considering natural/forced air cooling
  • Considering radiant heat
  • Considering heatsinks (number of fins, size)
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment

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